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C430C472F2H5HA7293 Datasheet(PDF) 7 Page - Kemet Corporation |
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C430C472F2H5HA7293 Datasheet(HTML) 7 Page - Kemet Corporation |
7 / 10 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1071_AXIMAX_X8R • 10/17/2016 7 Axial Through-Hole Multilayer Ceramic Capacitors Aximax, 400 Series, Axial, Conformally Coated, Ultra-Stable X8R Dielectric, 50 – 200 VDC (Commercial & Automotive Grade) Table 2 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Solderability J–STD–002 Magnification 50 X. Conditions: a) Method A, at 235°C, Category 3 Temperature Cycling JESD22 Method JA–104 5 cycles (−55°C to +150°C), measurement at 24 hours ±2 hours after test conclusion. Biased Humidity MIL–STD–202 Method 103 Load humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours ±2 hours after test conclusion. Low volt humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours ±2 hours after test conclusion. Moisture Resistance MIL–STD–202 Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours ±2 hours after test conclusion. Thermal Shock MIL–STD–202 Method 107 −55°C/+150°C. Note: Number of cycles required = 300. Maximum transfer time = 20 seconds. Dwell time – 15 minutes. Air – Air. High Temperature Life MIL–STD–202 Method 108 /EIA–198 1,000 hours at 150°C with 2 X rated voltage applied. Storage Life MIL–STD–202 Method 108 150°C, 0 VDC, for 1,000 hours. Vibration MIL–STD–202 Method 204 5 g for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB .031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz. Resistance to Soldering Heat MIL–STD–202 Method 210 Condition B. No preheat of samples. Note: single wave solder – procedure 2. Terminal Strength MIL–STD–202 Method 211 Conditions A (454g), Condition C (227g) Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition C. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical – OKEM Clean or equivalent. Storage & Handling The un-mounted storage life of a through-hole (leaded) ceramic capacitor is dependent upon storage and atmospheric conditions as well as packaging materials. While the ceramic chips enveloped under the epoxy coating themselves are quite robust in most environments, solderability of the wire lead on the final epoxy-coated product will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature and exposure to direct sunlight – reels may soften or warp, and tape peel force may increase. KEMET recommends storing the un-mounted capacitors in their original packaging, in a location away from direct sunlight, and where the temperature and relative humidity do not exceed 40 degrees centigrade and 70% respectively. For optimum solderability, capacitor stock should be used promptly, preferably within 18 months of receipt. For applications requiring pre-tinning of components, storage life may be extended if solderability is verified. Before cleaning, bonding or molding these devices, it is important to verify that your process does not affect product quality and performance. KEMET recommends testing and evaluating the performance of a cleaned, bonded or molded product prior to implementing and/or qualifying any of these processes. |
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