R08DS0115EJ0200 Rev.2.00

Page 9 of 12

Jan 21, 2016

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

•

Peak reflow temperature

260

C or below (package surface temperature)

•

Time of peak reflow temperature

10 seconds or less

•

Time of temperature higher than 220

C

60 seconds or less

•

Time to preheat temperature from 120 to 180

C

120

30 s

•

Number of reflows

Three or less

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% or less is

recommended.)

220˚C

Time (s)

(heating)

to 10 s

to 60 s

260˚C MAX.

Recommended Temperature Profile of Infrared Reflow

120±30 s

(preheating)

180˚C

120˚C

(2) Wave soldering

•

Temperature

260

C or below (molten solder temperature)

•

Time

10 seconds or less

•

Preheating conditions

120

C or below (package surface temperature)

•

Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% or less is recommended.)

(3) Soldering by Soldering Iron

•

Peak Temperature (lead part temperature) 350

C or below

•

Time (each pin)

3 seconds or less

•

Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% or less is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(4) Cautions

•

Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.