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OPA1641-Q1, OPA1642-Q1

SBOS791 – JUNE 2017

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Product Folder Links: OPA1641-Q1 OPA1642-Q1

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current-limited to 10 mA or less. The input voltage and output negative-voltage ratings can be exceeded if the input and output current

ratings are followed.

(3)

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

40

V

(V–) – 0.5

(V+) + 0.5

V

±10

mA

±VS

V

Continuous

Operating temperature

–55

125

°C

Junction temperature

–65

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±3000

V

Charged-device model (CDM), per AEC Q100-011

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage (V+, V–)

Single supply

4.5

36

V

Dual supply

±2.25

±18

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

OPA1641-Q1, OPA1642-Q1

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

160

180

°C/W

Junction-to-case (top) thermal resistance

75

55

°C/W

Junction-to-board thermal resistance

60

130

°C/W

Junction-to-top characterization parameter

9

n/a

°C/W

Junction-to-board characterization parameter

50

120

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W