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OPA145, OPA2145, OPA4145

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SBOS427 – JUNE 2017

Product Folder Links: OPA145 OPA2145 OPA4145

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Copyright © 2017, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2145

OPA2145

UNIT

D (SOIC)

DGK (VSSOP)

DSD (SON)

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

136

143

47

°C/W

Junction-to-case (top) thermal resistance

74

47

47

°C/W

Junction-to-board thermal resistance

62

64

22

°C/W

Junction-to-top characterization parameter

19.7

5.3

0.7

°C/W

Junction-to-board characterization parameter

54.8

62.8

22.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

9.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4145

OPA4145

UNIT

D (SOIC)

PW (TSSOP)

RUM (QFN)

14 PINS

14 PINS

16 PINS

Junction-to-ambient thermal resistance

86

93

35

°C/W

Junction-to-case (top) thermal resistance

46

28

33

°C/W

Junction-to-board thermal resistance

41

34

13

°C/W

Junction-to-top characterization parameter

11.3

1.9

0.3

°C/W

Junction-to-board characterization parameter

40.7

33.1

13.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

3.3

°C/W