DATA SHEET • SKY66112-11: ZIGBEE/THREAD/BLUETOOTH SMART FEM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

203225L • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • March 14, 2017

11

3.8 mm

3.3 mm

Package Outline

Exposed Center Pad

4X 0.55 mm

2X 0.85 mm

2X 1.0 mm

18X 0.3 mm

22X 0.55 mm

2X 0.5 mm

22X 0.65 mm

Stencil aperture size of

80 to 100% of the module/pkg

solder mask openings

Pin 22

Pin 1 indicator

0.30 X 0.30 mm

Pin 1

0.5 mm Pitch

Stencil Aperture

(Top View)

3.8 mm

3.3 mm

12X 0.55 mm

12X 0.3 mm

Package Outline

Pin 22

Pin 1

0.5 mm Pitch

0.25 mm Typ

Metallization

(Top View)

Exposed Center Pad

2X 1.0 mm

Opening size of

60 to 100% of exposed

center opening shown

Package Outline

Solder Mask Opening

(Top View)

3.9 mm

3.4 mm

4X 0.65 mm

18X 0.4 mm

Pin 22

Pin 1 indicator

0.30 X 0.30 mm

Pin 1

0.5 mm Pitch

Notes:

1. All measurements are in millimeters.

2. Thermal vias should be resin filled and capped in accordance with

IPC-4761 type VII vias. Recommended Cu thickness is 30 to 35

µm.

Thermal via array

Ø

0.3 mm on 0.6 mm pitch

improves thermal performance

203225-014

Figure 14. SKY66112-11 PCB Layout Footprint