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C1206C154MFRACAUTO Datasheet(PDF) 11 Page - Kemet Corporation

Part # C1206C154MFRACAUTO
Description  High Voltage X7R Dielectric, 500 - 3,000 VDC (Automotive Grade)
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

C1206C154MFRACAUTO Datasheet(HTML) 11 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1076_X7R_HV_AUTO_SMD • 11/21/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs)
High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Profile Feature
Termination Finish
SnPb
100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin)
100°C
150°C
Temperature Maximum (T
Smax)
150°C
200°C
Time (t
S) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (T
L)
183°C
217°C
Time Above Liquidous (t
L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (T
P)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (t
P)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (T
P to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
T
smin
25
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
t
P
t
L
t
s
25ºC to Peak


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