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SKY66298-11 Datasheet(PDF) 11 Page - Skyworks Solutions Inc.

Part # SKY66298-11
Description  2490 to 2690 MHz High-Efficiency 4 W Power Amplifier
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Manufacturer  SKYWORKS [Skyworks Solutions Inc.]
Direct Link  http://www.skyworksinc.com
Logo SKYWORKS - Skyworks Solutions Inc.

SKY66298-11 Datasheet(HTML) 11 Page - Skyworks Solutions Inc.

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DATA SHEET • SKY66297-11: 2490 TO 2690 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
203323E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017
11
Application Circuit Notes
Center Ground. It is extremely important to sufficiently ground
the bottom ground pad of the device for both thermal and stability
reasons. Multiple small vias are acceptable and work well under
the device if solder migration is an issue.
GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground
pins to the RF ground plane with the largest diameter and lowest
inductance via that the layout allows. Multiple small vias are
acceptable and will work well under the device if solder migration
is an issue.
VBIAS (pin 5). The bias supply voltage for each stage, nominally
set to +5 V.
RFOUT (pin 9). Amplifier RF output pin (ZO = 50
). The module
includes an internal DC blocking capacitor. All impedance
matching is provided internal to the module.
VCC1, VCC2, and VCC3 (pin 16, 14, and 12, respectively). Supply
voltage for each stage collector bias is nominally set to 5 V.
Bypass and decoupling capacitors C6 through C12 should be
placed in the approximate location shown on the evaluation board
assembly drawing, although exact placement is not critical.
RFIN (pin 2). Amplifier RF input pin (ZO = 50
). All impedance
matching is provided internal to the module. The module includes
an internal DC blocking capacitor.
Package Dimensions
Typical part marking for the SKY66297-11 is shown in
Figure 21.The PCB layout footprint for the SKY66297-11 is shown
in Figure 22. Package dimensions are shown in Figure 23, and
tape and reel dimensions are provided in Figure 24.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
The SKY66297-11 is rated to Moisture Sensitivity Level 3 (MSL3)
at 250
C. It can be used for lead or lead-free soldering. For
additional information, refer to Skyworks Application Note, PCB
Design and SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format.
Pin 1
Indicator
Skyworks
Part Number
Lot Code
Date Code:
YY = Calendar Year
WW = Work Week
CC = Country Code
203323C-021
66297-11
XXXXXXXXX
YYWW CC
Figure 21. Typical Part Marking for the SKY66297-11


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