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SKY66298-11 Datasheet(PDF) 11 Page - Skyworks Solutions Inc. |
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SKY66298-11 Datasheet(HTML) 11 Page - Skyworks Solutions Inc. |
11 / 14 page DATA SHEET • SKY66297-11: 2490 TO 2690 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 203323E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017 11 Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and work well under the device if solder migration is an issue. GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. VBIAS (pin 5). The bias supply voltage for each stage, nominally set to +5 V. RFOUT (pin 9). Amplifier RF output pin (ZO = 50 ). The module includes an internal DC blocking capacitor. All impedance matching is provided internal to the module. VCC1, VCC2, and VCC3 (pin 16, 14, and 12, respectively). Supply voltage for each stage collector bias is nominally set to 5 V. Bypass and decoupling capacitors C6 through C12 should be placed in the approximate location shown on the evaluation board assembly drawing, although exact placement is not critical. RFIN (pin 2). Amplifier RF input pin (ZO = 50 ). All impedance matching is provided internal to the module. The module includes an internal DC blocking capacitor. Package Dimensions Typical part marking for the SKY66297-11 is shown in Figure 21.The PCB layout footprint for the SKY66297-11 is shown in Figure 22. Package dimensions are shown in Figure 23, and tape and reel dimensions are provided in Figure 24. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY66297-11 is rated to Moisture Sensitivity Level 3 (MSL3) at 250 C. It can be used for lead or lead-free soldering. For additional information, refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Pin 1 Indicator Skyworks Part Number Lot Code Date Code: YY = Calendar Year WW = Work Week CC = Country Code 203323C-021 66297-11 XXXXXXXXX YYWW CC Figure 21. Typical Part Marking for the SKY66297-11 |
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