DATA SHEET • SKY66291-11: 1805 TO 1880 MHz HIGH-EFFICIENCY 4 W POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

203161E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • May 31, 2017

11

Application Circuit Notes

Center Ground. It is extremely important to sufficiently ground

the bottom ground pad of the device for both thermal and stability

reasons. Multiple small vias are acceptable and work well under

the device if solder migration is an issue.

GND (pins 1, 3, 4, 7, 8, 10, 11, 13, and 15). Attach all ground

pins to the RF ground plane with the largest diameter and lowest

inductance via that the layout allows. Multiple small vias are

acceptable and will work well under the device if solder migration

is an issue.

VBIAS (pin 5). The bias supply voltage for each stage, nominally

set to +5 V.

). The module

includes an onboard internal DC blocking capacitor. All

impedance matching is provided internal to the module.

VCC1, VCC2, and VCC3 (pin 16, 14, and 12, respectively). Supply

voltage for each stage collector bias is nominally set to 5 V.

Bypass and decoupling capacitors C6 through C12 should be

placed in the approximate location shown on the evaluation board

assembly drawing, although exact placement is not critical.

). The module

includes an onboard internal DC blocking capacitor. All

impedance matching is provided internal to the module.

Package Dimensions

Typical part marking for the SKY66291-11 is shown in Figure 21.

The PCB layout footprint for the SKY66291-11 is shown in

Figure 22. Package dimensions are shown in Figure 23, and tape

and reel dimensions are provided in Figure 24.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

The SKY66291-11 is rated to Moisture Sensitivity Level 3 (MSL3)

at 250

C. It can be used for lead or lead-free soldering. For

additional information, refer to Skyworks Application Note, PCB

Design and SMT Assembly/Rework Guidelines for MCM-L

Packages, document number 101752.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.

Pin 1

Indicator

Skyworks

Part Number

Lot Code

Date Code:

YY = Calendar Year

WW = Work Week

CC = Country Code

ts670

66291-11

XXXXXXXXX

YYWW CC

Figure 21. Typical Part Marking for the SKY66291-11