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T510E477M050ZTE800 Datasheet(PDF) 8 Page - Kemet Corporation

Part # T510E477M050ZTE800
Description  T510 Series Multiple Anode MnO2
Download  15 Pages
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Manufacturer  KEMET [Kemet Corporation]
Direct Link  http://www.kemet.com
Logo KEMET - Kemet Corporation

T510E477M050ZTE800 Datasheet(HTML) 8 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2014_T510 • 9/21/2016
88
Tantalum Surface Mount Capacitors – Low ESR
T510 Series Multiple Anode MnO
2
Soldering Process
KEMET’sfamiliesofsurfacemountcapacitorsare
compatiblewithwave(singleordual),convection,IR,
orvaporphasereflowtechniques.Preheatingofthese
components is recommended to avoid extreme thermal
stress.KEMET'srecommendedprofileconditionsfor
convectionandIRreflowreflecttheprofileconditionsofthe
IPC/J–STD–020D standard for moisture sensitivity testing.
Thedevicescansafelywithstandamaximumofthreereflow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstandwavesoldering,thetallprofile(4.3mmmaximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
difficultyinprocesscontrol.Ifperformed,careshouldbe
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reflowoccurs.Oncereflowoccurs,theironshouldbe
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Duringtypicalreflowoperations,aslightdarkeningofthe
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
TemperatureMinimum(T
Smin)
100°C
150°C
TemperatureMaximum(T
Smax)
150°C
200°C
Time(t
s)fromTsmin to Tsmax)
60 – 120 seconds
60 – 120 seconds
Ramp-upRate(T
L to TP)
3°C/secondsmaximum 3°C/secondsmaximum
LiquidousTemperature(T
L)
183°C
217°C
TimeAboveLiquidous(t
L)
60 – 150 seconds
60 – 150 seconds
PeakTemperature(T
P)
220°C*
235°C**
250°C*
260°C**
Timewithin5°CofMaximum
PeakTemperature(t
P)
20 seconds maximum
30 seconds maximum
Ramp-downRate(T
P to TL)
6°C/secondsmaximum 6°C/secondsmaximum
Time25°CtoPeak
Temperature
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum
storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation
onthepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychip
stock should be used promptly, preferably within three years of receipt.
Time
T
smin
25
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
t
P
t
L
t
s
25ºC to Peak


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