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AD6122 Datasheet(PDF) 3 Page - Analog Devices |
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AD6122 Datasheet(HTML) 3 Page - Analog Devices |
3 / 20 page REV. B AD6122 –3– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage DVCC, IFVCC, TXVCC to DGND, IFGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 V Internal Power Dissipation 2 . . . . . . . . . . . . . . . . . . . 600 mW Operating Temperature Range . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300 °C ORDERING GUIDE Temperature Package Model Range Package Description Option AD6122ARS –40 °C to +85°C Shrink Small Outline Package (SSOP) RS-28 AD6122ARSRL –40 °C to +85°C 28-Lead SSOP on Tape-and-Reel AD6122ACP –40 °C to +85°C Chip Scale Package (LPCC) CP-32 AD6122ACPRL –40 °C to +85°C 32-Leadless LPCC on Tape-and-Reel PIN CONFIGURATIONS LDOC 223 3 22 421 5 20 619 7 18 8 17 1 24 10 31 11 30 12 29 13 28 14 27 15 26 16 25 9 32 AD6122 Top View (Not to Scale) NC = NO CONNECT LDOB LDOGND LDOGND DGND LOIPP LOIPN DVCC MODOPP QIPP QIPN MODCMREF IIPN IIPP IFGND IFGND LPCC Package TOP VIEW (Not to Scale) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AD6122 IFGND TXVCC TXOPN TXOPP DVCC LOIPN LOIPP PD1 PD2 LDOE LDOB DGND LDOGND LDOC IFINN IFINP MODOPN MODOPP QIPP QIPN MODCMREF VGAIN REFIN REFOUT IFVCC IIPN IIPP IFGND SSOP Package CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD6122 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Thermal Characteristics: 28-lead SSOP Package: θ JA = 115.25 °C/W. |
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