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HSS-B20-NP-04 Datasheet(PDF) 1 Page - CUI INC |
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HSS-B20-NP-04 Datasheet(HTML) 1 Page - CUI INC |
1 / 3 page date 04/03/2017 page 1 of 3 cui.com MODEL: HSS-B20-NP-04 │ DESCRIPTION: HEAT SINK FEATURES • TO-220 package • round hole for component attachment • two hole options for longer component pins • black anodized finish MODEL thermal resistance1 power dissipation1 @ 75°C ΔT, nat conv (°C/W) @ 1 W, nat conv (°C/W) @ 1 W, 200 LFM (°C/W) @ 1 W, 400 LFM (°C/W) @ 75°C ΔT, nat conv (W) HSS-B20-NP-04 11.54 15.27 3.76 2.74 6.50 Note: 1. See performance curves for full thermal resistance details. PERFORMANCE CURVES 0 10 20 30 40 50 60 70 80 90 100 01 23 45 6789 10 Dissipated Power (W) Without Airflow 200 LFM 400 LFM Heatsink Temperature Rise Above Ambient (ΔT = Ths - Ta) (°C) Power (W) Natural Conv. 200 LFM 400 LFM 0 0 0 0 1 15.27 3.76 2.74 2 27.05 7.51 5.43 3 38.74 11.26 8.23 4 48.62 15.04 11.17 5 59.41 18.81 13.89 6 69.24 22.56 16.83 7 79.43 26.28 19.71 8 88.27 30.18 22.48 9 95.85 33.95 25.41 10 104.56 37.87 28.29 Ths: “hot spot” temperature measured on the heatsink Ta: ambient temperature For more information, please visit the product page. |
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