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CM1451-08CP Datasheet(PDF) 8 Page - ON Semiconductor |
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CM1451-08CP Datasheet(HTML) 8 Page - ON Semiconductor |
8 / 10 page CM1451 http://onsemi.com 8 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 9. Recommended Non−Solder Mask Defined Pad Illustration Figure 10. Lead−free (SnAgCu) Solder Ball Reflow Profile 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 Time (minutes) |
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