CM1230

http://onsemi.com

7

PACKAGE DIMENSIONS

WLCSP4, 0.96x0.96

CASE 567CS

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.61

MILLIMETERS

A1

D

0.96 BSC

E

b

0.29

0.34

e

0.50 BSC

0.69

D

E

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

4X

b

12

B

A

0.05 C

A

A1

A2

C

0.21

0.28

0.96 BSC

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

A2

0.41 REF

PITCH

0.25

4X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.50

RECOMMENDED

A1

PACKAGE

OUTLINE

WLCSP6, 1.46x0.96

CASE 567BB

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.56

MILLIMETERS

A1

D

1.46 BSC

E

b

0.29

0.35

e

0.50 BSC

0.72

D

E

A B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

6X

b

12

3

B

A

0.05 C

A

A1

A2

C

0.21

0.27

0.96 BSC

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

A2

0.42 REF

PITCH

0.25

6X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

0.50

RECOMMENDED

A1

PACKAGE

OUTLINE

OptiGuard Option