CM1224

http://onsemi.com

8

PACKAGE DIMENSIONS

SOT−143

CASE 318A−06

ISSUE U

DIM

D

MIN

MAX

2.80

3.05

MILLIMETERS

E1

1.20

1.40

A

0.80

1.12

b

0.30

0.51

b1

0.76

0.94

e

1.92 BSC

L

0.35

0.70

c

0.08

0.20

L2

0.25 BSC

e1

0.20 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM­

UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO­

TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,

AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.

DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR

PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL

NOT EXCEED 0.25 PER SIDE.

5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.

6. DATUMS A AND B ARE DETERMINED AT DATUM H.

A-B

M

0.20

D

C

A

0.10 C

SIDE VIEW

SEATING

PLANE

SOLDERING FOOTPRINT*

0.75

4X

DIMENSIONS: MILLIMETERS

0.54

1.92

3X

RECOMMENDED

A1

0.01

0.15

D

B

TOP VIEW

D

3X

b

E

b1

E1

e

e1

A

A1

C

c

END VIEW

H

c

SEATING

PLANE

L2

L

GAUGE

PLANE

DETAIL A

DETAIL A

2.70

0.20

0.96

E

2.10

2.64

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.