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AC0402KRX7R6BB Datasheet(PDF) 15 Page - YAGEO Corporation

Part No. AC0402KRX7R6BB
Description  SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

AC0402KRX7R6BB Datasheet(HTML) 15 Page - YAGEO Corporation

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Automotive grade
NP0
/X7R 6.3 V to 630 V
www.yageo.com
Mar. 31, 2017 V.6
Surface-Mount Ceramic Multilayer Capacitors
15
24
Product specification
SOLDERING CONDITIONS
The lead free MLCCs are able to stand the reflow soldering conditions as below:
Temperature: above 220 °C
Endurance: 95 to 120 seconds
Cycles: 3 times
The test of "soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202F-method 210F", "The robust
construction of chip capacitors allows them to be completely immersed in a solder bath of 270 °C for 10 seconds". Therefore, it is possible
to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested
for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds.
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Mounting
IEC 60384-
21/22
4.3
The capacitors may be mounted on printed-circuit boards or
ceramic substrates
No visible damage
Capacitance
IEC 60384-
21/22
4.5.1
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
Within specified tolerance
Dissipation
Factor (D.F.)
IEC 60384-
21/22
4.5.2
Class 1:
At 20 °C, 24 hours after annealing
f = 1 MHz for C ≤ 1nF, measuring at voltage 1 Vrms at 20 °C
f = 1 KHz for C > 1nF, measuring at voltage 1 Vrms at 20 °C
Class 2:
At 20 °C, 24 hours after annealing
f = 1 KHz, measuring at voltage 1 Vrms at 20 °C
In accordance with
specification
Insulation
Resistance
IEC 60384-
21/22
4.5.3
At Ur (DC) for 1 minute
In accordance with
specification
SOLDERING RECOMMENDATION
Table 15
SOLDERING
METHOD
SIZE
0402
0603
0805
1206
≥ 1210
Reflow
≥ 0.1 µF
≥ 1.0 µF
≥ 2.2 µF
≥ 4.7 µF
Reflow only
Reflow/Wave
< 0.1 µF
< 1.0 µF
< 2.2 µF
< 4.7 µF
---
TESTS AND REQUIREMENTS
Table 16 Test procedures and requirements


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