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NTD20N06L Datasheet(PDF) 1 Page - ON Semiconductor |
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NTD20N06L Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 8 page © Semiconductor Components Industries, LLC, 2014 September, 2014 − Rev. 4 1 Publication Order Number: NTD20N06L/D NTD20N06L, NTDV20N06L Power MOSFET 20 A, 60 V, Logic Level, N−Channel DPAK/IPAK Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits. Features • AEC Q101 Qualified − NTDV20N06L • These Devices are Pb−Free and are RoHS Compliant Typical Applications • Power Supplies • Converters • Power Motor Controls • Bridge Circuits MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDSS 60 Vdc Drain−to−Gate Voltage (RGS = 10 MW) VDGR 60 Vdc Gate−to−Source Voltage − Continuous − Non−repetitive (tpv10 ms) VGS VGS ±15 ±20 Vdc Drain Current − Continuous @ TA = 25°C − Continuous @ TA = 100°C − Single Pulse (tpv10 ms) ID ID IDM 20 10 60 Adc Apk Total Power Dissipation @ TA = 25°C Derate above 25 °C Total Power Dissipation @ TA = 25°C (Note 1) Total Power Dissipation @ TA = 25°C (Note 2) PD 60 0.40 1.88 1.36 W W/ °C W W Operating and Storage Temperature Range TJ, Tstg − 55 to +175 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 5.0 Vdc, L = 1.0 mH, IL(pk) = 16 A, VDS = 60 Vdc) EAS 128 mJ Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2) RqJC RqJA RqJA 2.5 80 110 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8 in from case for 10 seconds TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. When surface mounted to an FR4 board using 1 in pad size, (Cu Area 1.127 in2). 2. When surface mounted to an FR4 board using recommended pad size, (Cu Area 0.412 in2). http://onsemi.com MARKING DIAGRAMS & PIN ASSIGNMENTS A = Assembly Location* Y = Year WW = Work Week 20N6L = Device Code G = Pb−Free Package See detailed ordering and shipping information on page 2 of this data sheet. ORDERING INFORMATION 1 Gate 3 Source 2 Drain 4 Drain DPAK CASE 369C STYLE 2 1 2 3 4 1 Gate 3 Source 2 Drain 4 Drain IPAK CASE 369D STYLE 2 1 2 3 4 N−Channel D S G 60 V 39 m W@5.0 V RDS(on) TYP 20 A (Note 1) ID MAX V(BR)DSS * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. |
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