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IRU1260CT Datasheet(PDF) 5 Page - International Rectifier

Part # IRU1260CT
Description  DUAL 6A AND 1A LOW DROPOUT POSITIVE ADJUSTABLE REGULATOR
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

IRU1260CT Datasheet(HTML) 5 Page - International Rectifier

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IRU1260
5
Rev. 2.1
09/19/02
www.irf.com
Stability
The IRU1260 requires the use of an output capacitor as
part of the frequency compensation in order to make the
regulator stable. Typical designs for the microprocessor
applications use standard electrolytic capacitors with
typical ESR in the range of 50 to 100m
V and the output
capacitance of 500 to 1000
mF. Fortunately as the ca-
pacitance increases, the ESR decreases resulting in a
fixed RC time constant. The IRU1260 takes advantage
of this phenomena in making the overall regulator loop
stable. For most applications a minimum of 100
mF alu-
minum electrolytic capacitor with the maximum ESR of
0.3
V such as Sanyo, MVGX series, Panasonic FA se-
ries as well as the Nichicon PL series insures both sta-
bility and good transient response. The IRU1260 also
requires a 1
mF ceramic capacitor connected from VIN to
VCTRL and a 10
V, 0.1W resistor in series with VCTRL pin
in order to further insure stability.
Thermal Design
The IRU1260 incorporates an internal thermal shutdown
that protects the device when the junction temperature
exceeds the maximum allowable junction temperature.
Although this device can operate with junction tempera-
tures in the range of 150
8C, it is recommended that the
selected heat sink be chosen such that during maxi-
mum continuous load operation the junction tempera-
ture is kept below this number. The example given shows
the steps in selecting the proper regulator heat sink for
driving the Pentium
IITM processor GTL+ termination
resistors and the Clock IC using the IRU1260 TO-263
package.
Example:
Assuming the following specifications:
The steps for selecting a proper heat sink to keep the
junction temperature below 135
8C is given as:
1) Calculate the maximum power dissipation using:
2) Assuming a TO-263 surface mount package, the junc-
tion to ambient thermal resistance of the package is:
3) The maximum junction temperature of the device is
calculated using the equation below:
Since this is lower than our selected 135
8C maxi-
mum junction temperature (150
8C is the thermal shut-
down of the device), TO-263 package is a suitable
package for our application.
VIN = 3.3V
VOUT1 = 2.5V
VOUT2 = 1.5V
IOUT1(MAX) = 0.2A
IOUT2(MAX) = 1.5A
TA = 35
8C
PD = IOUT1
3(VIN - VOUT1) + IOUT23(VIN - VOUT2)
PD = 0.2
3(3.3 - 2.5) + 1.53(3.3 - 1.5) = 2.86W
uJA = 308C/W for 1" square pad area
TJ = TA + PD
3uJA
TJ = 35 + 2.86
330 = 1218C


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