P9221-R Datasheet

© 2017 Integrated Device Technology, Inc.

9

April 4, 2017

4. Thermal Characteristics

Table 4.

Package Thermal Information

Note: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 76.2 x 114.3 mm in still air conditions.

Symbol

Description

WLCSP Rating 8 Thermal Balls

Units

Thermal Resistance Junction to Ambient[a]

47

C/W

Thermal Resistance Junction to Case

0.202

C/W

Thermal Resistance Junction to Board

4.36

C/W

Operating Junction Temperature[a]

-5 to +125

C

Ambient Operating Temperature[a]

0 to +85

C

Storage Temperature

-55 to +150

C

Maximum Soldering Temperature (Reflow, Pb-Free)

260

C

result in excessive die temperature, and the device will enter thermal shutdown.

5. Electrical Characteristics

Table 5.

Electrical Characteristics

Symbol

Description

Conditions

Min

Typical

Max

Units

Under-Voltage Lock-Out (UVLO)

UVLO Rising

Rising voltage on VRECT

2.9

2.98

V

UVLO Hysteresis

VRECT falling

200

mV

Over-Voltage Protection

DC Over-Voltage

Protection

Rising voltage

13.5

V

Over-Voltage Hysteresis

1

V

Quiescent Current

Supply Current

EN

¯¯ = Low, No load; VRECT = 12.3V

3.0

mA

Shut Down Mode Current

EN

¯¯ = High; VRECT = 12.3V

500

μA

VDD18 Voltage

VDD18 Pin Output

Voltage[a]

1.62

1.8

1.98

V