Automotive grade

NP0

www.yageo.com

Mar. 31, 2017 V.6

Surface-Mount Ceramic Multilayer Capacitors

15

24

Product specification

SOLDERING CONDITIONS

The lead free MLCCs are able to stand the reflow soldering conditions as below:



Temperature: above 220 °C



Endurance: 95 to 120 seconds



Cycles: 3 times

The test of "soldering heat resistance" is carried out in accordance with the schedule of "MIL-STD-202F-method 210F", "The robust

construction of chip capacitors allows them to be completely immersed in a solder bath of 270 °C for 10 seconds". Therefore, it is possible

to mount MLCCs on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Capacitors are tested

for solderability at 245 °C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds.

TEST

TEST METHOD

PROCEDURE

REQUIREMENTS

Mounting

IEC 60384-

21/22

4.3

The capacitors may be mounted on printed-circuit boards or

ceramic substrates

No visible damage

Capacitance

IEC 60384-

21/22

4.5.1

Class 1:

At 20 °C, 24 hours after annealing

Class 2:

At 20 °C, 24 hours after annealing

Within specified tolerance

Dissipation

Factor (D.F.)

IEC 60384-

21/22

4.5.2

Class 1:

At 20 °C, 24 hours after annealing

Class 2:

At 20 °C, 24 hours after annealing

In accordance with

specification

Insulation

Resistance

IEC 60384-

21/22

4.5.3

In accordance with

specification

SOLDERING RECOMMENDATION

Table 15

SOLDERING

METHOD

SIZE

0402

0603

0805

1206

≥ 1210

Reflow

≥ 0.1 µF

≥ 1.0 µF

≥ 2.2 µF

≥ 4.7 µF

Reflow only

Reflow/Wave

< 0.1 µF

< 1.0 µF

< 2.2 µF

< 4.7 µF

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TESTS AND REQUIREMENTS

Table 16 Test procedures and requirements