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TRF7960RHBT Datasheet(PDF) 4 Page - Texas Instruments |
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TRF7960RHBT Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 54 page  4 TRF7960, TRF7961 SLOU186G – AUGUST 2006 – REVISED MAY 2017 www.ti.com Submit Documentation Feedback Product Folder Links: TRF7960 TRF7961 Revision History Copyright © 2006–2017, Texas Instruments Incorporated 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from August 12, 2010 to May 18, 2017 Page • Removed "and AGC" from "Selectable Receiver Gain" in Section 1.1, Features ........................................... 1 • Updated list of applications .......................................................................................................... 1 • Changed contents of Section 1.3, Description .................................................................................... 1 • Added Device Information table .................................................................................................... 2 • Added Section 1.4, Typical Application ............................................................................................ 2 • Added Section 3, Device Comparison, and moved Table 3-1 to it ............................................................. 5 • Added Section 3.1, Related Products ............................................................................................. 5 • Changed the title of Section 4 from Physical Characteristics to Terminal Configuration and Functions .................. 6 • Removed former Section 3.2, Packaging and Ordering Information (see Section 9, Mechanical, Packaging, and Orderable Information) ............................................................................................................... 7 • Updated note (1) on Section 5.1, Absolute Maximum Ratings, to standard wording ........................................ 8 • Moved ESD ratings from Absolute Maximum Ratings to Section 5.2, ESD Ratings; changed ratings from positive voltages only to positive and negative; added notes for HBM and CDM ...................................................... 8 • Changed format of MIN, TYP, and MAX columns in Section 5.4, Electrical Characteristics ............................... 8 • Added the fD_CLKmax parameter in Section 5.4, Electrical Characteristics ..................................................... 9 • Changed title of and moved Section 5.5, Thermal Resistance Characteristics .............................................. 9 • Moved contents of Section 6.1, Overview from former Section 2 ............................................................. 10 • Removed a paragraph that began "The second receiver gain stage and digitizer stage..." in Section 6.3, Receiver – Analog Section ......................................................................................................... 17 • Added the last sentence to the paragraph that begins "The start of the receive operation (successfully received SOF)..." in Section 6.3.2, Receiver – Digital Section .......................................................................... 18 • Added "and ISO/IEC 15693" to the first sentence of the paragraph that begins "The framing section also supports bit-collision detection..." in Section 6.3.2, Receiver – Digital Section ............................................. 18 • Changed B2 to Reserved in Table 6-11, Chip Status Control Register (Address = 00h) ................................. 23 • Changed B1 and B0 to Reserved in Table 6-22, RX Special Setting Register (Address = 0Ah) ........................ 28 • Corrected the name of the Reset FIFO command in Table 6-31, Command Codes, and Section 6.5.2, Reset FIFO 31 • Added the last sentence to the paragraph that begins "The serial communications work in the same manner..." in Section 6.8, Serial Interface Communication ................................................................................. 36 • Removed former section External Power Amplifier Application ............................................................... 40 • Added Section 7, Applications, Implementation, and Layout, and moved the application schematics to it ............. 41 • Added Section 8, Device and Documentation Support ......................................................................... 43 • Added Section 9, Mechanical, Packaging, and Orderable Information ...................................................... 46 |
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