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TPS61096A

SLVSE09A – APRIL 2017 – REVISED APRIL 2017

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Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

MIN

MAX

UNIT

Voltage range at terminals

VIN, EN, ILIM, LVI1, LVI2

–0.3

6

V

FB

-0.3

3.6

V

SW, VOUT, VOSNS, HVO1,

HVO2

–0.3

32

V

–40

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.1 ESD Ratings

VALUE

UNIT

Electrostatic discharge

± 2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

± 500

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

1.8

5.5

V

Boost converter output voltage

4.5

28

V

L

Inductor

1.0

2.2

47

µH

Input capacitor

1.0

4.7

µF

Output capacitor

10

10

100

µF

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.3 Thermal Information

TPS61096A

UNIT

DSS (WSON)

12 PINS

Junction-to-ambient thermal resistance

65.1

°C/W

Junction-to-case (top) thermal resistance

72.4

°C/W

Junction-to-board thermal resistance

29.7

°C/W

Junction-to-top characterization parameter

2.5

°C/W

Junction-to-board characterization parameter

29.7

°C/W

Junction-to-case (bottom) thermal resistance

10.7

°C/W