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DSS0012B Datasheet(PDF) 4 Page - Texas Instruments |
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DSS0012B Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 TPS61096A SLVSE09A – APRIL 2017 – REVISED APRIL 2017 www.ti.com Product Folder Links: TPS61096A Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications MIN MAX UNIT Voltage range at terminals VIN, EN, ILIM, LVI1, LVI2 –0.3 6 V FB -0.3 3.6 V SW, VOUT, VOSNS, HVO1, HVO2 –0.3 32 V Operating junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.1 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ± 2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ± 500 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 1.8 5.5 V VOUT Boost converter output voltage 4.5 28 V L Inductor 1.0 2.2 47 µH CIN Input capacitor 1.0 4.7 µF COUT Output capacitor 10 10 100 µF TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.3 Thermal Information THERMAL METRIC(1) TPS61096A UNIT DSS (WSON) 12 PINS RθJA Junction-to-ambient thermal resistance 65.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.4 °C/W RθJB Junction-to-board thermal resistance 29.7 °C/W ψJT Junction-to-top characterization parameter 2.5 °C/W ψJB Junction-to-board characterization parameter 29.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 10.7 °C/W |
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