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TUSB2077A Datasheet(PDF) 6 Page - Texas Instruments |
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TUSB2077A Datasheet(HTML) 6 Page - Texas Instruments |
6 / 26 page TUSB2077A SLLS414F – MARCH 2000 – REVISED AUGUST 2015 www.ti.com 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT VCC Supply voltage 3 3.3 3.6 V VI Input voltage, TTL/LVCMOS(1) 0 VCC V VO Output voltage, TTL/LVCMOS(2) 0 VCC V VIH(REC) High-level input voltage, signal-ended receiver 2 VCC V VIL(REC) Low-level input voltage, signal-ended receiver 0.8 V VIH(TTL) High-level input voltage, TTL/LVCMOS(1) 2 VCC V VIL(TTL) Low-level input voltage, TTL/LVCMOS(1) 0 0.8 V TA Operating free-air temperature 0 70 °C R(DRV) External series, differential driver resistor 22 Ω f(OPRH) Operating (dc differential driver) high speed mode 12 Mb/s f(OPRL) Operating (dc differential driver) low speed mode 1.5 Mb/s VICR Common mode, input range, differential receiver 0.8 2.5 V tt Input transition times, TTL/LVCMOS (1) 0 25 ns TJ Junction temperature(3) 0 115 °C (1) Applies for input and bidirectional buffers. (2) Applies for output and bidirectional buffers. (3) These junction temperatures reflect simulated conditions. Absolute maximum junction temperature is 150°C. The customer is responsible for verifying junction temperature. 7.4 Thermal Information TUSB2077A THERMAL METRIC(1) PT (LQFP) UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 66.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 21.1 °C/W RθJB Junction-to-board thermal resistance 37.8 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 31.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: TUSB2077A |
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