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TPS3808G33DBVRG4 Datasheet(PDF) 5 Page - Texas Instruments |
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TPS3808G33DBVRG4 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 32 page 5 TPS3808 www.ti.com SBVS050K – MAY 2004 – REVISED OCTOBER 2015 Product Folder Links: TPS3808 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) As a result of the low dissipated power in this device, it is assumed that TJ = TA. 7 Specifications 7.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage VDD –0.3 7 V VCT –0.3 VDD + 0.3 V VRESET, VMR, VSENSE –0.3 7 V Current RESET pin –5 5 mA Temperature Operating junction, TJ (2) –40 150 °C Storage, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input supply range 1.7 6.5 V VSENSE SENSE pin voltage 0 6.5 V V(Ct) CT pin voltage VDD V VMR MR pin voltage 0 6.5 V VRESET RESET pin voltage 0 6.5 V IRESET RESET pin current 0.0003 5 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS3808 UNIT DBV (SOT-23) DRV (WSON) 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 180.9 178.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 117.8 95.6 °C/W RθJB Junction-to-board thermal resistance 27.8 135 °C/W ψJT Junction-to-top characterization parameter 1.12 6.3 °C/W ψJB Junction-to-board characterization parameter 27.3 136.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.3 °C/W |
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