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HPA00234DRCRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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HPA00234DRCRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 26 page www.ti.com DEVICE INFORMATION 1 2 3 4 5 10 9 8 7 6 Vout VFB SELV SELI Vin IFB Iset GND Iout SW 10 pin 3*3 mm QFN PACKAGE (TOP VIEW) Exposed Thermal Pad TPS61140 TPS61141 SLVS624B – JANUARY 2006 – REVISED MARCH 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION OVP PACKAGE TA PACKAGE(1) (typ) MARKING –40 to 85 °C TPS61140DRCR 28 V BCP –40 to 85 °C TPS61141DRCR 22 V BRG –40 to 85 °C TPS61140DRCT 28 V BCP –40 to 85 °C TPS61141DRCT 22 V BRG (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. The input pin to the IC. It provides the current to the boost regulator output, and also powers the IC circuit. VIN 5 I When the Vin voltage is below the undervoltage lockout threshold, the IC turns off and disables outputs. GND 8 O The ground of the IC. Connect the input and output capacitors very close to this pin. SW 6 I This is the switching node of the IC where the PWM switching Is created. IOUT 7 O The output of the constant current supply. It is directly connected to the boost regulator output. The output of the voltage regulator. There is a low dropout linear regulator (LDO) between the Iout and Vout VOUT 1 O pins which regulates the Vout voltage. Turning off the LDO disconnects the Vout from Iout. The voltage feedback pin for Vout regulation. It is regulated to an internal reference voltage. An external voltage VFB 2 I divider connected to this pin programs the output voltage. The return path for the Iout regulation. The current regulator is connected to this pin, and it can be disabled by IFB 10 I opening the current path. The current output programming pin. The resistor connected to the pin programs the regulated current of the ISET 9 I Iout pin. SELI, 4, 3 I Mode selection pins. See Table 1 for details. SELV The thermal pad should be soldered to the analog ground. If possible, use thermal via to connect to ground Thermal Pad plane for ideal power dissipation. 2 Submit Documentation Feedback |
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