ABSOLUTE MAXIMUM RATINGS

(1)

POWER DISSIPATION RATINGS

TPS767D3xx

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DEVICE

TPS767D301

Adjustable (1.5V – 5.5V)

3.3V

TPS767D318

1.8V

3.3V

TPS767D325

2.5V

3.3V

(1)

For the most current specifications and package information see the Package Option Addendum at the end of this document, or see the

TI web site at www.ti.com.

Over operating temperature range (unless otherwise noted).

TPS767D3xx

UNIT

(2)

–0.3 to +13.5

V

V

–0.3 to +7.0

V

–0.3 to +16.5

V

Peak output current

Internally limited

ESD rating, HBM

2

kV

Continuous total power dissipation

See Dissipation Ratings table

–40 to +125

°C

–65 to +150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network terminal ground.

AIR FLOW

DERATING FACTOR

PACKAGE

(CFM)

POWER RATING

POWER RATING

POWER RATING

0

3.58 W

35.8 mW/°C

1.97 W

1.43 W

250

5.07 W

50.7 mW/°C

2.79 W

2.03 W

(1)

This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1oz. copper on 4-in × 4-in ground layer.

For more information, refer to TI technical brief literature number SLMA002.

2

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