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L6738A Datasheet(PDF) 10 Page - STMicroelectronics

Part # L6738A
Description  Embedded bootstrap diode
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6738A Datasheet(HTML) 10 Page - STMicroelectronics

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Pin description and connection diagrams
L6738A
10/32
Doc ID 18134 Rev 2
2.2
Thermal data
8COMP
Error amplifier output.
Connect with an RF - CF to FB. The device cannot be disabled by grounding this pin.
9FB
Error amplifier inverting input.
Connect with a resistor RFB to VSEN and with an RF - CF to COMP.
10
VSEN
Output voltage monitor.
It manages OVP and UVP protections and PGOOD. Connect to the positive side of the
load for remote sensing. See Section 6 for details.
11
FBG
Remote ground sense.
Connect to the negative side of the load for remote sensing.
12
CSN
Current sense negative input.
Connect to the output-side of the main inductor. Filter with 100 nF (Typ.) to GND.
13
CSP
Current sense positive input.
Connect through an R-C filter to the phase-side of the main inductor.
14
OSC
OSC: Internally set to 1.24 V, it allows programming the switching frequency FSW of the
device. Switching frequency can be increased according to the resistor ROSC connected
to SGND with a gain of 10 kHz/µA (see Section 7 for details). If floating, the switching fre-
quency is 200 kHz.
15
VCC
Device power supply. The embedded bootstrap diode is internally connected to this pin.
Operative voltage is 5 V to 12 V bus. Filter with 1
µF MLCC to GND.
For proper operations, VCC needs to be >1.5 V higher than the programmed VOUT.
16
GND
All internal references, logic and driver return path are referenced to this pin. Connect to
the PCB GND ground plane and filter to VCC and VCCDR.
Thermal
PAD
The thermal pad connects the silicon substrate and makes good thermal contact with the
PCB. Use VIAs to connect to the PGND plane.
Table 2.
Pin description (continued)
Pin#
Name
Function
Table 3.
Thermal data
Symbol
Parameter
Value
Unit
RTHJA
Thermal resistance junction to ambient
(Device soldered on 2s2p PC Board)
45
°C/W
RTHJC
Thermal resistance junction to case
1
°C/W
TMAX
Maximum junction temperature
150
°C
TSTG
Storage temperature range
-40 to 150
°C
TJ
Junction temperature range
-40 to 125
°C


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