Electronic Components Datasheet Search
  English  ▼

Delete All


Preview PDF Download HTML

TMS45160 Datasheet(PDF) 3 Page - Texas Instruments

Part No. TMS45160
Download  23 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Maker  TI [Texas Instruments]
Homepage  http://www.ti.com

TMS45160 Datasheet(HTML) 3 Page - Texas Instruments

Zoom Inzoom in Zoom Outzoom out
 3 / 23 page
background image
TMS45160, TMS45160P
HOUSTON, TEXAS 77251–1443
data in (DQ0 – DQ15)
Data is written during a write or read-modify-write cycle. Depending on the mode of operation, the falling edge
of xCAS or W strobes data into the on-chip data latch. In an early-write cycle, W is brought low prior to xCAS
and the data is strobed in by the first occurring xCAS with setup and hold times referenced to data in. In a
delayed-write or read-modify-write cycle, xCAS is already low and the data is strobed in by W with setup and
hold times referenced to data in. In a delayed-write or read-modify-write cycle, OE must be high to bring the
output buffers to the high-impedance state prior to impressing data on the I/O lines.
data out (DQ0 – DQ15)
The 3-state output buffer provides direct TTL compatibility ( no pullup resistor required ) with a fanout of two
Series 74 TTL loads. Data out is the same polarity as data in. The output is in the high-impedance ( floating )
state until xCAS and OE are brought low. In a read cycle, the output becomes valid after the access-time interval
tCAC (which begins with the negative transition of xCAS) as long as tRAC and tAA are satisfied.
output enable (OE)
OE controls the impedance of the output buffers. When OE is high, the buffers remain in the high-impedance
state. Bringing OE low during a normal cycle activates the output buffers, putting them in the low-impedance
state. It is necessary for both RAS and xCAS to be brought low for the output buffers to go into the
low-impedance state. They remain in the low-impedance state until either OE or xCAS is brought high.
RAS-only refresh
A refresh operation must be performed at least once every 8 ms ( 64 ms for TMS45160P ) to retain data. This
can be achieved by strobing each of the 512 rows ( A0 – A8). A normal read or write cycle refreshes all bits in
each row that is selected. A RAS-only operation can be used by holding all xCAS at the high ( inactive ) level,
conserving power as the output buffers remain in the high-impedance state. Externally generated addresses
must be used for a RAS-only refresh.
hidden refresh
Hidden refresh can be performed while maintaining valid data at the output pin. This is accomplished by holding
xCAS at VIL after a read operation and cycling RAS after a specified precharge period, similar to a RAS-only
refresh cycle. The external address is ignored and the refresh address is generated internally.
xCAS-before-RAS (xCBR) refresh
xCBR refresh is utilized by bringing at least one xCAS low earlier than RAS ( see parameter tCSR) and holding
it low after RAS falls ( see parameter tCHR). For successive xCBR refresh cycles, xCAS can remain low while
cycling RAS. The external address is ignored and the refresh address is generated internally.
A low-power battery-backup refresh mode that requires less than 500-
µA refresh current is available on the
TMS45160P. Data integrity is maintained using xCBR refresh with a period of 125
µs holding
RAS low for less than 1
µs. To minimize current consumption, all input levels must be at CMOS levels
(VIL ≤ 0.2 V, VIH ≥ VCC – 0.2 V).
self refresh ( TMS45160P )
The self-refresh mode is entered by dropping xCAS low prior to RAS going low. Then xCAS and RAS are both
held low for a minimum of 100
µs. The chip is refreshed internally by an on-board oscillator. No external address
is required since the CBR counter is used to keep track of the address. To exit the self-refresh mode, both RAS
and xCAS are brought high to satisfy tCHS. Upon exiting the self-refresh mode, a burst refresh (refresh a full set
of row addresses) must be executed before continuing with normal operation. This ensures that the DRAM is
fully refreshed.

Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23 

Datasheet Download

Link URL

Privacy Policy
Does ALLDATASHEET help your business so far?  [ DONATE ]  

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Alldatasheet API   |   Link Exchange   |   Manufacturer List
All Rights Reserved© Alldatasheet.com

Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn