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LP2951-XX-Q1 Datasheet(PDF) 3 Page - Texas Instruments |
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LP2951-XX-Q1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 30 page SHUTDOWN 3 6 VTAP GND 4 5 ERROR OUTPUT 1 SENSE 2 8 INPUT 7 FEEDBACK OUTPUT SENSE SHUTDOWN GND 1 8 2 Thermal 7 3 6 4 5 INPUT FEEDBACK V TAP ERROR LP2951-33-Q1, LP2951-50-Q1 www.ti.com SLVSAW6E – JUNE 2011 – REVISED NOVEMBER 2014 5 Pin Configuration and Functions D Package DRG Package 8-Pin SOIC 8-Pin WSON With Exposed Thermal Pad LP2591-50-Q1 Top View Top View Pin Functions PIN TYPE DESCRIPTION NAME NO. Active-low open-collector error output. Goes low when VOUT drops by 6% of its ERROR 5 O nominal value. Determines the output voltage. Connect to VTAP (with OUTPUT tied to SENSE) FEEDBACK 7 I to output the fixed voltage corresponding to the part version, or connect to a resistor divider to adjust the output voltage. GND 4 — Ground INPUT 8 I Supply input OUTPUT 1 O Voltage output. Senses the output voltage. Connect to OUTPUT (with FEEDBACK tied to VTAP) SENSE 2 I to output the voltage corresponding to the part version. SHUTDOWN 3 I Active-high input. Shuts down the device. VTAP 6 O Tie to FEEDBACK to output the fixed voltage corresponding to the part version. 6 Specifications 6.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Input voltage range –0.3 35 V VSHDN SHUTDOWN input voltage range –1.5 35 V ERROR comparator output voltage range(2) –1.5 30 V VFDBK FEEDBACK input voltage range (2) (3) –1.5 30 V TJ Operating virtual-junction temperature 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) May exceed input supply voltage (3) If load is returned to a negative power supply, the output must be diode clamped to GND. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per AEC Q100-002(1)(2) 0 2000 Corner pins (1, 4, 8, 0 1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per and 5) AEC Q100-011 Other pins 0 1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. (2) LP2951-50QDRQ1 Feedback pin survives up to 1500V HBM Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LP2951-33-Q1 LP2951-50-Q1 |
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