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ISO1540D Datasheet(PDF) 8 Page - Texas Instruments |
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ISO1540D Datasheet(HTML) 8 Page - Texas Instruments |
8 / 34 page 8 ISO1540, ISO1541 SLLSEB6D – JULY 2012 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: ISO1540 ISO1541 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated 6.7 Safety-Related Certifications VDE CSA UL CQC Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010-1 Approved under CSA Component Acceptance Notice 5A, CSA/IEC 60950-1, and CSA/IEC 61010-1 Recognized under UL 1577 Component Recognition Program Certified according to GB4943.1- 2011 Basic Insulation Maximum Transient Overvoltage, 4242 VPK; Maximum Repetitive Peak Voltage, 566 VPK 2.8-kVRMS Insulation Rating; 400 VRMS Basic Insulation working voltage per CSA 60950-1- 07+A1+A2 and IEC 60950-1 2nd Ed.+A1+A2; 300 VRMS Basic, 150 VRMS Reinforced Insulation working voltage per CSA 61010-1-12 and IEC 61010-1 3rd Ed., Single protection, 2500 VRMS Basic Insulation, Altitude ≤ 5000 m, Tropical Climate, 250 VRMS maximum working voltage Certificate number: 40016131 Master contract number: 220991 File number: E181974 Certificate number: CQC14001109540 6.8 Safety Limiting Values Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current RθJA = 114.6°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 198 mA RθJA = 114.6°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 303 TS Safety temperature 150 °C The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. |
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