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CC2591RGVRG4 Datasheet(PDF) 4 Page - Texas Instruments |
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CC2591RGVRG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page AVDD_PA1 1 2 3 4 12 11 10 9 5 6 7 8 16 15 14 13 QFN-16 4x4mm RF_N RXTX RF_P GND ANT GND AVDD_PA2 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 www.ti.com 3 Terminal Configuration and Functions The CC2591 pinout and description are shown in Figure 3-1 and Table 3-1, respectively. Figure 3-1. PIN AND I/O CONFIGURATION (TOP VIEW) NOTE The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2591 is mounted onto layer 1. 4 Terminal Configuration and Functions Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 |
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