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CC2530F128RHAT Datasheet(PDF) 4 Page - Texas Instruments

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Part # CC2530F128RHAT
Description  A True System-on-Chip Solution for 2.4-GHz IEEE 802.15.4 and ZigBee Applications
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

CC2530F128RHAT Datasheet(HTML) 4 Page - Texas Instruments

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CC2530F32, CC2530F64
CC2530F128, CC2530F256
SWRS081B
– APRIL 2009 – REVISED FEBRUARY 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
MIN
MAX
UNIT
Supply voltage
All supply pins must have the same voltage
–0.3
3.9
V
–0.3
VDD + 0.3,
Voltage on any digital pin
V
≤ 3.9
Input RF level
10
dBm
Storage temperature range
–40
125
°C
All pads, according to human-body model, JEDEC STD 22, method A114
2
kV
ESD(2)
According to charged-device model, JEDEC STD 22, method C101
500
V
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
CAUTION: ESD sensitive device. Precaution should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
UNIT
Operating ambient temperature range, TA
–40
125
°C
Operating supply voltage
2
3.6
V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Digital regulator on. 16-MHz RCOSC running. No radio, crystals, or peripherals active.
3.4
mA
Medium CPU activity: normal flash access(1), no RAM access
32-MHz XOSC running. No radio or peripherals active.
6.5
8.9
mA
Medium CPU activity: normal flash access(1), no RAM access
32-MHz XOSC running, radio in RX mode,
–50-dBm input power, no peripherals active, CPU
20.5
mA
idle
32-MHz XOSC running, radio in RX mode at -100-dBm input power (waiting for signal), no
24.3
29.6
mA
peripherals active, CPU idle
Core current
Icore
consumption
32-MHz XOSC running, radio in TX mode, 1-dBm output power, no peripherals active, CPU idle
28.7
mA
32-MHz XOSC running, radio in TX mode, 4.5-dBm output power, no peripherals active, CPU
33.5
39.6
mA
idle
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-MHz crystal oscillator off;
0.2
0.3
mA
32.768-kHz XOSC, POR, BOD and sleep timer active; RAM and register retention
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-MHz crystal oscillator off;
1
2
μA
32.768-kHz XOSC, POR, and sleep timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active; RAM and register retention
0.4
1
μA
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
Timer 1
Timer running, 32-MHz XOSC used
90
μA
Timer 2
Timer running, 32-MHz XOSC used
90
μA
Timer 3
Timer running, 32-MHz XOSC used
60
μA
Iperi
Timer 4
Timer running, 32-MHz XOSC used
70
μA
Sleep timer
Including 32.753-kHz RCOSC
0.6
μA
ADC
When converting
1.2
mA
Erase
1
mA
Flash
Burst write peak current
6
mA
(1)
Normal flash access means that the code used exceeds the cache storage, so cache misses happen frequently.
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
WAKE-UP AND TIMING
4
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© 2009–2011, Texas Instruments Incorporated
Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256


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