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STDLED625 Datasheet(PDF) 5 Page - STMicroelectronics

Part # STDLED625
Description  Gate charge minimized
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STDLED625 Datasheet(HTML) 5 Page - STMicroelectronics

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DocID025167 Rev 1
5/18
STDLED625, STULED625
Electrical characteristics
The built-in back-to-back Zener diodes have been specifically designed to enhance not only
the device’s ESD capability, but also to make them capable of safely absorbing any voltage
transients that may occasionally be applied from gate to source. In this respect, the Zener
voltage is appropriate to achieve efficient and cost-effective protection of device integrity.
The integrated Zener diodes thus eliminate the need for external components.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
VDD = 310 V, ID = 2.75 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 15)
-22
-
ns
tr
Rise time
-
12
-
ns
td(off)
Turn-off-delay time
-
49
-
ns
tf
Fall time
-
20
-
ns
Table 7. Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
ISD
Source-drain current
-
5.5
A
ISDM
(1)
1.
Pulse width limited by safe operating area.
Source-drain current (pulsed)
27
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%.
Forward on voltage
ISD = 5.5 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 18)
-290
ns
Qrr
Reverse recovery charge
-
1900
nC
IRRM
Reverse recovery current
-
13.5
A
trr
Reverse recovery time
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 18)
-335
ns
Qrr
Reverse recovery charge
-
2400
nC
IRR
Reverse recovery current
-
14.5
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
V(BR)GSO
Gate-source breakdown
voltage
IGS = ± 1 mA, ID = 0
30
-
-
V
Obsolete
Product(s)
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Product(s)


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