Characteristics

FERD40U45C

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DocID024891 Rev 1

Figure 7. Thermal resistance junction to ambient versus copper surface under tab

(typical values)

Rth(j-a) (°C/W)

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

D²PAK

S(Cu) (cm²)

Epoxy printed circuit board FR4,

copper thickness: 35 µm