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VCA824IDG4 Datasheet(PDF) 4 Page - Texas Instruments

Part No. VCA824IDG4
Description  Ultra-Wideband, > 40-dB Gain Adjust Range, Linear in V/V Variable Gain Amplifier
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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VCA824IDG4 Datasheet(HTML) 4 Page - Texas Instruments

 
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VCA824
SBOS394D – NOVEMBER 2007 – REVISED JANUARY 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Power supply
±6.5
V
Internal power dissipation
See Thermal Information
Input voltage
±VS
V
Junction temperature (TJ)
260
°C
Junction temperature (TJ), continuous operation
140
°C
Storage temperature
–65
125
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-
V(ESD)
Electrostatic discharge
±500
V
C101(2)
Machine model (MM)
±200
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Operating voltage
7
10
12
V
Operating temperature
–40
25
85
°C
7.4 Thermal Information
VCA824
THERMAL METRIC(1)
D (SOIC)
DGS (VSSOP)
UNIT
14 PINS
10 PINS
RθJA
Junction-to-ambient thermal resistance
90.3
173.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
49.8
46.6
°C/W
RθJB
Junction-to-board thermal resistance
44.9
94.3
°C/W
ψJT
Junction-to-top characterization parameter
13.8
2.2
°C/W
ψJB
Junction-to-board characterization parameter
44.6
92.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953
4
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Copyright © 2007–2016, Texas Instruments Incorporated
Product Folder Links: VCA824


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