OPAx191 datasheet(6/51 Pages) TI1

Part #	OPAx191

Description	36-V, Low Power, Precision, CMOS, Rail-to-Rail Input/Output, Low Offset Voltage, Low Input Bias Current Op Amp

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Manufacturer	TI1 [Texas Instruments]

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OPA191, OPA2191, OPA4191

SBOS701A – DECEMEBER 2015 – REVISED APRIL 2016

www.ti.com

Product Folder Links: OPA191 OPA2191 OPA4191

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Thermal Information: OPA2191

THERMAL METRIC(1)

OPA2191

UNIT

8 PINS

D (SOIC)

DGK (VSSOP)

RθJA

Junction-to-ambient thermal resistance

107.9

158

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

53.9

48.6

°C/W

RθJB

Junction-to-board thermal resistance

48.9

78.7

°C/W

ψJT

Junction-to-top characterization parameter

6.6

3.9

°C/W

ψJB

Junction-to-board characterization parameter

48.3

77.3

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.6 Thermal Information: OPA4191

THERMAL METRIC(1)

OPA4191

UNIT

14 PINS

D (SOIC)

PW (TSSOP)

RθJA

Junction-to-ambient thermal resistance

86.4

92.6

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

46.3

27.5

°C/W

RθJB

Junction-to-board thermal resistance

41.0

33.6

°C/W

ψJT

Junction-to-top characterization parameter

11.3

1.9

°C/W

ψJB

Junction-to-board characterization parameter

40.7

33.1

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

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OPAx191 Datasheet(PDF) 6 Page - Texas Instruments

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