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TLV70245DBVR Datasheet(PDF) 4 Page - Texas Instruments

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Part No. TLV70245DBVR
Description  300-mA, Low-IQ, Low-Dropout Regulator
Download  33 Pages
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TLV70245DBVR Datasheet(HTML) 4 Page - Texas Instruments

 
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TLV702
SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
IN
–0.3
6
Voltage(2)
EN
–0.3
6
V
OUT
–0.3
6
Current (source)
OUT
Internally limited
Output short-circuit duration
Indefinite
Total continuous power dissipation
See Thermal Information
Operating virtual junction, TJ
–55
150
Temperature
°C
Storage, Tstg
–55
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2)
All voltages are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
±500
all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted).
MIN
NOM
MAX
UNIT
VIN
2
5.5
V
VOUT
1.2
4.8
V
IOUT
0
300
mA
6.4 Thermal Information
TLV702
THERMAL METRIC(1)
DBV (SOT-23)
DSE (WSON)
UNIT
5 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
249.2
321.3
RθJC(top)
Junction-to-case (top) thermal resistance
136.4
207.9
RθJB
Junction-to-board thermal resistance
85.9
281.5
°C/W
ψJT
Junction-to-top characterization parameter
19.5
42.4
ψJB
Junction-to-board characterization parameter
85.3
284.8
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
142.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Product Folder Links: TLV702


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