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TLV70245DBVR Datasheet(PDF) 16 Page - Texas Instruments

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Part No. TLV70245DBVR
Description  300-mA, Low-IQ, Low-Dropout Regulator
Download  33 Pages
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TLV70245DBVR Datasheet(HTML) 16 Page - Texas Instruments

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COUT
VOUT
VIN
GND PLANE
CIN
Represents via used for
application specific connections
IN
GND
OUT
NC
EN
NC
TLV702
SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015
www.ti.com
Layout Examples (continued)
Figure 29. Layout Example for the DSE Package
10.3 Thermal Consideration
Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the
device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a
result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125°C maximum.
To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature
until the thermal protection is triggered; use worst-case loads and signal conditions.
The internal protection circuitry of the TLV702 has been designed to protect against overload conditions. It was
not intended to replace proper heatsinking. Continuously running the TLV702 into thermal shutdown degrades
device reliability.
10.4 Package Mounting
Solder pad footprint recommendations for the TLV702 are available from the TI website at www.ti.com. The
recommended land pattern for the DBV and DSE packages are shown in Figure 28 and Figure 29, respectively.
16
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Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: TLV702


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