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TPS22810 Datasheet(PDF) 24 Page - Texas Instruments

Part # TPS22810
Description  2.7-18-V, On-Resistance Load Switch With Thermal Protection
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS22810 Datasheet(HTML) 24 Page - Texas Instruments

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J(MAX)
A
D(MAX)
JA
T
T
P
-
=
q
1
VOUT
2
QOD
3
CT 4
EN/UVLO
5
GND
6
VIN
VIA to Power Ground Plane
24
TPS22810
SLVSDH0B – DECEMBER 2016 – REVISED MAY 2017
www.ti.com
Product Folder Links: TPS22810
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
12 Layout
12.1 Layout Guidelines
1. VIN and VOUT traces must be as short and wide as possible to accommodate for high current.
2. The VIN pin must be bypassed to ground with low ESR ceramic bypass capacitors. The typical
recommended bypass capacitance is 1-μF ceramic with X5R or X7R dielectric. This capacitor must be
placed as close to the device pins as possible.
12.2 Layout Example
Figure 34. Recommended Board Layout
12.3 Thermal Considerations
For best performance, all traces must be as short as possible. To be most effective, the input and output
capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
The maximum IC junction temperature must be restricted to 150°C under normal operating conditions. To
calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use
Equation 14.
where
PD(MAX) is the maximum allowable power dissipation
TJ(MAX) is the maximum allowable junction temperature (150°C for the TPS22810)
TA is the ambient temperature of the device
θJA is the junction to air thermal impedance. Refer to the Thermal Information table. This parameter is highly
dependent upon board layout.
(14)


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