5

REF3312, REF3318, REF3320, REF3325, REF3330, REF3333

www.ti.com

SBOS392G – AUGUST 2007 – REVISED DECEMBER 2016

Product Folder Links: REF3312 REF3318 REF3320 REF3325 REF3330 REF3333

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Copyright © 2007–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See the Power-Supply Recommendations section of this data sheet.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

Voltage

Input voltage

7.5

V

Output voltage

5

Current

(2)

180

mA

Temperature

Operating

–50

150

°C

150

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

±1000

Machine model (MM)

±200

(1)

The minimum supply voltage for the REF3312 is 1.7 V.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

5.5

V

Output current range

–30

30

mA

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

REF33xx

REF3325,

REF3330

UNIT

DCK (SC70)

DBZ (SOT-23)

RSE (UQFN)

3 PINS

3 PINS

8 PINS

Junction-to-ambient thermal resistance

279.7

313.1

61.2

°C/W

Junction-to-case (top) thermal resistance

136.3

144.0

32.6

°C/W

Junction-to-board thermal resistance

56.9

109.3

16.0

°C/W

Junction-to-top characterization parameter

11.0

18.2

1.3

°C/W

Junction-to-board characterization parameter

56.1

107.9

16.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W