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REF3318 Datasheet(PDF) 5 Page - Texas Instruments |
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REF3318 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 37 page 5 REF3312, REF3318, REF3320, REF3325, REF3330, REF3333 www.ti.com SBOS392G – AUGUST 2007 – REVISED DECEMBER 2016 Product Folder Links: REF3312 REF3318 REF3320 REF3325 REF3330 REF3333 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) See the Power-Supply Recommendations section of this data sheet. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted). (1) MIN MAX UNIT Voltage Input voltage 7.5 V Output voltage 5 Current Output short-circuit, ISC (2) 180 mA Temperature Operating –50 150 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 Machine model (MM) ±200 (1) The minimum supply voltage for the REF3312 is 1.7 V. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted). MIN NOM MAX UNIT VIN Supply input voltage(1) VOUT + 0.2 5.5 V IOUT Output current range –30 30 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) REF33xx REF3325, REF3330 UNIT DCK (SC70) DBZ (SOT-23) RSE (UQFN) 3 PINS 3 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 279.7 313.1 61.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 136.3 144.0 32.6 °C/W RθJB Junction-to-board thermal resistance 56.9 109.3 16.0 °C/W ψJT Junction-to-top characterization parameter 11.0 18.2 1.3 °C/W ψJB Junction-to-board characterization parameter 56.1 107.9 16.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W |
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Similar Description - REF3318 |
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