5

ISO7710-Q1

www.ti.com

SLLSEU2 – MARCH 2017

Product Folder Links: ISO7710-Q1

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ISO7710-Q1

UNIT

DW (SOIC)

D (SOIC)

(16-Pin)

(8-Pin)

Junction-to-ambient thermal resistance

94.4

146.1

°C/W

Junction-to-case(top) thermal resistance

57.3

63.1

°C/W

Junction-to-board thermal resistance

57.1

80.0

°C/W

Junction-to-top characterization parameter

40.0

9.6

°C/W

Junction-to-board characterization parameter

56.8

79.0

°C/W

Junction-to-case(bottom) thermal resistance

n/a

n/a

°C/W

6.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation

input a 50 MHz 50% duty cycle square wave

50

mW

Maximum power dissipation by side-1

input a 50 MHz 50% duty cycle square wave

12.5

mW

Maximum power dissipation by side-2

input a 50 MHz 50% duty cycle square wave

37.5

mW