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FERD20U50DJF-TR Datasheet(PDF) 5 Page - STMicroelectronics |
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FERD20U50DJF-TR Datasheet(HTML) 5 Page - STMicroelectronics |
5 / 8 page DocID026021 Rev 3 5/8 FERD20U50 Package information 8 2 Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT-8L package information Figure 8. PowerFLAT-8L package outline D2 E2 K L b e D E A A1 A2 |
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