NTHD4502N

http://onsemi.com

6

PACKAGE DIMENSIONS

ChipFET]

CASE 1206A−03

ISSUE K

STYLE 2:

PIN 1. SOURCE 1

2. GATE 1

3. SOURCE 2

4. GATE 2

5. DRAIN 2

6. DRAIN 2

7. DRAIN 1

8. DRAIN 1

E

A

b

e

e1

D

12

34

87

65

c

L

1

2

3

4

8

7

6

5

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.

4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL

AND VERTICAL SHALL NOT EXCEED 0.08 MM.

5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.

6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD

SURFACE.

0.05 (0.002)

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.00

1.05

1.10

0.039

INCHES

b

0.25

0.30

0.35

0.010

c

0.10

0.15

0.20

0.004

D

2.95

3.05

3.10

0.116

E

1.55

1.65

1.70

0.061

e

0.65 BSC

e1

0.55 BSC

L

0.28

0.35

0.42

0.011

0.041

0.043

0.012

0.014

0.006

0.008

0.120

0.122

0.065

0.067

0.025 BSC

0.022 BSC

0.014

0.017

NOM

MAX

1.80

1.90

2.00

0.071

0.075

0.079

5

° NOM

q

5

° NOM

q

SOLDERING FOOTPRINT

0.457

0.018

2.032

0.08

0.65

0.025

PITCH

0.66

0.026

mm

inches

2.362

0.093

1

8X

8X

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