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MT40A1G8 Datasheet(PDF) 32 Page - Micron Technology |
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MT40A1G8 Datasheet(HTML) 32 Page - Micron Technology |
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32 / 373 page  Figure 11: 96-Ball FBGA – x16 (JY) 1.8 CTR Nonconductive overmold 0.155 Seating plane 0.12 A Ball A1 ID (covered by SR) Ball A1 ID 0.34 ±0.05 1.1 ±0.1 6.4 CTR 8 ±0.1 0.8 TYP 12 CTR 14 ±0.1 96X Ø0.47 Dimensions apply to solder balls post- reflow on Ø0.42 SMD ball pads. 0.8 TYP 1 2 3 7 8 9 A B C D E F G H J K L M N P R T A Notes: 1. All dimensions are in millimeters. 2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu). 8Gb: x4, x8, x16 DDR4 SDRAM Package Dimensions 09005aef861d1d4a 8gb_ddr4_dram.pdf - Rev. G 1/17 EN 32 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2015 Micron Technology, Inc. All rights reserved. |
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