Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

AS4C4M32SA-7TCN Datasheet(PDF) 5 Page - Alliance Semiconductor Corporation

Part # AS4C4M32SA-7TCN
Description  4M x 32bit -AS4C4M32SA - 86-pin TSOP II PACKAGE
Download  47 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4C4M32SA-7TCN Datasheet(HTML) 5 Page - Alliance Semiconductor Corporation

  AS4C4M32SA-7TCN Datasheet HTML 1Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 2Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 3Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 4Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 5Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 6Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 7Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 8Page - Alliance Semiconductor Corporation AS4C4M32SA-7TCN Datasheet HTML 9Page - Alliance Semiconductor Corporation Next Button
Zoom Inzoom in Zoom Outzoom out
 5 / 47 page
background image
Pin Descriptions
Table
2. Pin Details
Symbol
Type
Description
CLK
Input
Clock: CLK is driven by the system clock. All SDRAM input signals are sampled on
the positive edge of CLK. CLK also increments the internal burst counter and
controls the output registers.
CKE
Input
Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal. If CKE
goes low synchronously with clock(set-up and hold time same as other inputs), the
internal clock is suspended from the next clock cycle and the state of output and
burst address is frozen as long as the CKE remains low. When all banks are in the
idle state, deactivating the clock controls the entry to the Power Down and Self
Refresh modes. CKE is synchronous except after the device enters Power Down
and Self Refresh modes, where CKE becomes asynchronous until exiting the same
mode. The input buffers, including CLK, are disabled during Power Down and Self
Refresh modes, providing low standby power.
BA0, BA1
Input
Bank Activate: BA0 and BA1 defines to which bank the BankActivate, Read, Write,
or BankPrecharge command is being applied. The bank address BA0 and BA1 is
used latched in mode register set.
A0-A11
Input
Address Inputs: A0-A11 are sampled during the BankActivate command (row
address A0-A11) and Read/Write command (column address A0-A7 with A10
defining Auto Precharge) to select one location out of the 1M available in the
respective bank. During a Precharge command, A10 is sampled to determine if all
banks are to be precharged (A10 = HIGH). The address inputs also provide the op-
code during a Mode Register Set or Special Mode Register Set command.
CS#
Input
Chip Select: CS# enables (sampled LOW) and disables (sampled HIGH) the
command decoder. All commands are masked when CS# is sampled HIGH. CS#
provides for external bank selection on systems with multiple banks. It is considered
part of the command code.
RAS#
Input
Row Address Strobe: The RAS# signal defines the operation commands in
conjunction with the CAS# and WE# signals and is latched at the positive edges of
CLK. When RAS# and CS# are asserted "LOW" and CAS# is asserted "HIGH,"
either the BankActivate command or the Precharge command is selected by the
WE# signal. When the WE# is asserted "HIGH," the BankActivate command is
selected and the bank designated by BA is turned on to the active state. When the
WE# is asserted "LOW," the Precharge command is selected and the bank
designated by BA is switched to the idle state after the precharge operation.
CAS#
Input
Column Address Strobe: The CAS# signal defines the operation commands in
conjunction with the RAS# and WE# signals and is latched at the positive edges of
CLK. When RAS# is held "HIGH" and CS# is asserted "LOW," the column access is
started by asserting CAS# "LOW." Then, the Read or Write command is selected by
asserting WE# "LOW" or "HIGH."
WE#
Input
Write Enable: The WE# signal defines the operation commands in conjunction with
the RAS# and CAS# signals and is latched at the positive edges of CLK. The WE#
input is used to select the BankActivate or Precharge command and Read or Write
command.
DQM0-
DQM3
Input
Data Input/Output Mask: Data Input Mask: DQM0-DQM3 are byte specific.
Input
data is masked when DQM is sampled HIGH during a write cycle. DQM3 masks
DQ31-DQ24, DQM2 masks DQ23-DQ16, DQM1 masks DQ15-DQ8, and DQM0
masks DQ7-DQ0.
DQ0-
DQ31
Input/
Output
Data I/O: The DQ0-31 input and output data are synchronized with the positive
edges of CLK. The I/Os are byte-maskable during Reads and Writes.
AS4C4M32SA-6TIN
AS4C4M32SA-6TCN
AS4C4M32SA-7TCN
Confidential
-5/47-
Rev.1.0 Sep.2015


Similar Part No. - AS4C4M32SA-7TCN

ManufacturerPart #DatasheetDescription
logo
Alliance Semiconductor ...
AS4C4M32S ALSC-AS4C4M32S Datasheet
1Mb / 46P
   Programmable Mode
AS4C4M32S-6BIN ALSC-AS4C4M32S-6BIN Datasheet
1Mb / 46P
   Programmable Mode
AS4C4M32S-7BCN ALSC-AS4C4M32S-7BCN Datasheet
1Mb / 46P
   Programmable Mode
More results

Similar Description - AS4C4M32SA-7TCN

ManufacturerPart #DatasheetDescription
logo
Hanbit Electronics Co.,...
HMF4M32B8VN HANBIT-HMF4M32B8VN Datasheet
430Kb / 13P
   FLASH-ROM MODULE 16MByte (4M x 32Bit), 144-Pin SODIMM, 3.3V
logo
Samsung semiconductor
K4S51323P SAMSUNG-K4S51323P Datasheet
142Kb / 12P
   4M x 32Bit x 4 Banks Mobile-SDRAM
logo
Hanbit Electronics Co.,...
HMF4M32M8G HANBIT-HMF4M32M8G Datasheet
417Kb / 11P
   FLASH-ROM MODULE 16MByte (4M x 32Bit), 72-Pin SIMM, 5V
logo
Elite Semiconductor Mem...
M53D5123216A ESMT-M53D5123216A Datasheet
1Mb / 47P
   4M x 32Bit x 4 Banks Mobile DDR SDRAM
logo
Alliance Semiconductor ...
AS4C2M32SA ALSC-AS4C2M32SA Datasheet
5Mb / 54P
   64Mb SDRAM AS4C2M32SA - 86pin TSOP II PACKAGE
logo
Samsung semiconductor
K4M513233C SAMSUNG-K4M513233C Datasheet
142Kb / 12P
   4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
K4S51323L SAMSUNG-K4S51323L Datasheet
144Kb / 12P
   4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
K4M513233E SAMSUNG-K4M513233E Datasheet
140Kb / 12P
   4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
K4M51323LE-M SAMSUNG-K4M51323LE-M Datasheet
141Kb / 12P
   4M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
logo
Mosel Vitelic, Corp
V55C2128164V MOSEL-V55C2128164V Datasheet
591Kb / 44P
   128Mbit LOW-POWER SDRAM 2.5 VOLT, TSOP II / BGA PACKAGE 8M X 16
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com