Package information

BAL-NRF02D3

8/11

DocID024794 Rev 6

3.2

Flip-chip 5 bumps packing information

Figure 12: Marking

Figure 13: Flip Chip tape and reel specifications

More packing information is available in the application note:



AN2348 Flip-

Chip: “Package description and recommendations for use”



AN4315: “BAL-NRF02D3 matched balun with integrated harmonics filter for

Nordic Semiconductor ultralow power transceivers”

x

y

x

w

z

w

Dot, ST logo

ECOPACK grade

xx = marking

z = manufacturing

location

yww = datecode