Absolute Maximum Ratings

If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Voltage at Any Pin

Operating Temperature

Storage Temperature

Junction Temperature

Lead Temperature (Soldering 10 sec)

300 C

Molded DIP Package Board Mount

25W

Molded DIP Package Socket Mount

23W

Molded DIP Package board mount

Derate 204 mW C above 25 C

Molded DIP Package socket mount

Derate 185 mW C above 25 C

Parameter

Conditions

Min

Typ

Max

Units

Power Supply

475

11

V

Power Supply Current

Excluding Output Loads

7

mA

Input Voltages

mA Input Bias

08

V

22

V

V

Brightness Input (Note 2)

0

075

mA

Output Sink Current

Segment OFF

10

mA

Segment ON

mA0

10

mA

mA

20

27

4

mA

mA15

25

mA

Brightness Input Voltage (Pin 19)

Input Current 750

mA

30

43

V

Output Matching (Note 1)

%

Clock Input

(Notes 5 and 6)

500

kHz

950

ns

950

ns

Data Input

300

ns

300

ns

Data Enable Input

100

ns

Note 1

Note 2

With a fixed resistor on the brightness input pin some variation in brightness will occur from one device to another Maximum brightness input current can

be 2 mA as long as Note 3 and junction temperature equation are complied with

Note 3

See

Figures 5 6

and

Note 4

Note 5

Note 6

Clock input rise and fall times must not exceed 300 ns

Connection Diagrams

Dual-In-Line Package

TLF6136 – 2

Top View

FIGURE 2a

Dual-In-Line Package

TLF6136 – 3

Top View

FIGURE 2b

Order Number MM5450N MM5451N MM5450V or MM5451V

See NS Package Number N40A or V44A

2