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Document Number: 69845

S-82119-Rev. B, 08-Sep-08

Vishay Siliconix

Si8451DB

PACKAGE OUTLINE

MICRO FOOT: 6-BUMP (2 x 3, 0.5 mm PITCH)

Notes (Unless otherwise specified):

1. All dimensions are in millimeters.

2. Six (6) solder bumps are lead (Pb)-free 95.5Sn/3.8Ag/0.7Cu with diameter

∅ 0.30 to 0.32 mm.

3. Backside surface is coated with a Ti/Ni/Ag layer.

4. Non-solder mask defined copper landing pad.

5.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

e

e

S

S

D

D

S

G

A

B

C

1

2

Recommended Land

E

e

Mark on Backside of Die

s

XXX

8451

s

e

6 x Ø 0.24 to 0.26 Note 3

Solder Mask ~ Ø 0.25

Bump Note 2

6 x Ø b

Dim.

Inches

Min.

Nom.

Max.

Min.

Nom.

Max.

A

0.510

0.575

0.590

0.0201

0.0224

0.0232

0.220

0.250

0.280

0.0087

0.0098

0.0110

0.290

0.300

0.310

0.0114

0.0118

0.0122

b

0.300

0.310

0.320

0.0118

0.0122

0.0126

e

0.500

0.0197

s

0.230

0.250

0.270

0.0090

0.0098

0.0106

D

0.920

0.960

1.000

0.0362

0.0378

0.0394

E

1.420

1.460

1.500

0.0559

0.0575

0.0591