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TLP750 Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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TLP750 Datasheet(HTML) 2 Page - Toshiba Semiconductor |
2 / 7 page TLP750 2002-09-25 2 Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Forward current (Note 1) IF 25 mA Pulse forward current (Note 2) IFP 50 mA Peak transient forward current (Note 3) IFPT 1 A Reverse voltage VR 5 V Diode power dissipation (Note 4) PD 45 mW Output current IO 8 mA Peak output current IOP 16 mA Output voltage VO -0.5~15 V Supply voltage VCC -0.5~15 V Output power dissipation (Note 5) PO 100 mW Operating temperature range Topr -55~100 °C Storage temperature range Tstg -55~125 °C Lead solder temperature(10s) (Note 6) Tsol 260 °C Isolation voltage (AC, 1min., R.H=60%) (Note 7) BVS 5000 Vrms (Note 1) Derate 0.8mA / °C above 70°C. (Note 2) 50% duty cycle, 1ms pulse width. Derate 1.6mA / °C above 70°C. (Note 3) Pulse width ≤ 1µs, 300pps. (Note 4) Derate 0.9mW / °C above 70°C. (Note 5) Derate 2mW / °C above 70°C. (Note 6) Soldering portion of lead: Up to 2mm from the body of the device. (Note 7) Device considered a two terminal device: Pins 1, 2, 3 and 4 shorted together and pins 5, 6, 7 and 8 shorted together. |
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