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TC2014 Datasheet(PDF) 3 Page - Microchip Technology

Part No. TC2014
Description  50 mA, 100 mA, 150 mA CMOS LDOs with Shutdown and Reference Bypass
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC2014 Datasheet(HTML) 3 Page - Microchip Technology

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 2003 Microchip Technology Inc.
DS21662C-page 3
TC2014/2015/2185
Power Supply
Rejection Ratio
PSRR
55
dB
F
≤ 1 kHz, Cbypass=0.01 µF
Output Short Circuit
Current
IOUTSC
160
300
mA
VOUT = 0V
Thermal Regulation
∆VOUT/∆PD
—0.04
V/W
Note 6, Note 7
Output Noise
eN
200
nV/
√Hz IL = IOUTMAX, F = 10 kHz
470 pF from Bypass to GND
Response Time,
(Note 8)
(from Shutdown Mode)
TR
—60
µsec
VIN = 4V, IL = 30 mA,
CIN = 1 µF, COUT = 10 µF
SHDN Input
SHDN Input High
Threshold
VIH
60
——
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low
Threshold
VIL
——
15
%VIN
VIN = 2.5V to 6.0V
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value at a V differential.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 msec.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
8: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TCVOUT
VOUTMAX VOUTMIN
() 10
6
×
VOUT
T
×
----------------------------------------------------------------------------
=


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